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European IS-Test Workshop 2007

"Hot / Cold Wafer Probing - Challenge or Nightmare"

from May 21-22, 2007

We are happy to invite you to the first European IS-Test-Workshop 2007 featuring
"Hot / Cold Wafer Probing". The workshop is solely technical oriented. It provides after lectures a dinner, offering the possibility of relaxed conversations and exchange of ideas.


Agenda

Day 1, May-21-2007
Start Session Duration
13:00 Registration
Reception of badges, presentation papers etc. 		60min
14:00 Opening Remarks to the 1st IS-Test Workshop (ITWS)

Organisational items to the workshop, agenda, time lines, general
Speaker: Peter Haigner / Jürgen Ockens / Torsten Liese 		15min
14:15 1st Session by IS-Test GmbH Munich

"Hot / Cold Probing - Challenge or Nightmare"
Speaker: Torsten Liese

- Q & A related to this session 		45min
15:00 Coffee break 15min
15:15 2nd Session by ATT Systems GmbH, Munich

"Air Cool vs. Liquid Cool"
Speaker: Markus Eibl

- Q & A related to this session 		45min
16:00 Coffee break 15min
16:15 3rd Session by Qimonda Dresden

"Preheating concept for probing systems (active head plate heating)"
Speaker: Peter Janusch

- Q & A related to this session 		30min
16:45 Coffee break 15min
14:15 4th Session by ITS Europe

"Variations of Chuck and Cleaning Unit Surfaces when probing at temperature"
Speaker: Wayne Fitzgerald

- Q & A related to this session 		45min
18:30 Dinner open
 
Day 2, May-22-2007
09:15 5th Session by X-FAB Semiconductor Foundries AG, Erfurt

"Investigation of test problems from view of failure analysis"
Speaker: Ekkehart Brandstädt

- FA methods especially for investigation of test problems
- efforts and results
- examples
- Q & A related to this session 		30min
09:45 6th Session by IS-Test GmbH Munich

"Wafer Probing Equipment - process specific challenges"
Speaker: Torsten Liese

- Q & A related to this session 		30min
10:15 Coffee break 15min
10:30 7th Session by Infineon & Qimonda Dresden

"Hot / Cold Probing at IFD / QD; Process Requirements, Roadmap for future products"
Speaker: Andreas Gneupel & René Gérard

- Q & A related to this session 		45min
11:15 Coffee break 30min
11:45 8th Session by IS- Test

"Summary of 1st Workshop and theme proposal for 2nd ITWS"
Speaker: Peter Haigner / Jürgen Ockens / Torsten Liese

15min
12:00 End of workshop  
 
Download this agenda and registration form at the bottom of this page



Location of the workshop
Best Western Hotel München-Airport
Robert-Koch-Straße 10
85435 Erding

Phone: +49 (0) 8122-99-90-0
Fax: +49 (0) 8122-99-90-100
Web: http://airport-muenchen.bestwestern.de/


We recommend the Best Western Hotel München-Airport for the overnight stay from 21st - 22nd May 2007. Please refer to the IS-Test-Workshop when you book the hotel to get a special rate.
Shuttle to the hotel
If you arrive per airplane, you can use the shuttle service from the airport to the hotel for 9,50 EUR per person.
The shuttle departs every 30 minutes on the hour from the airport to the hotel.
How to arrive the hotel by car
See the direction to the hotel as PDF file or download it as zipped PDF file.
Registration fee
The registration fee for both days per person is 185.00 EUR without VAT for non German companies or 220.15 EUR including 19% (35.15 EUR) VAT for German companies. This includes:
  • Seminar papers
  • Soft drinks during the coffee breaks
  • Appetizer at the evening before dinner
  • Dinner (without drinks)
We would be happy to see you at the workshop and ask you to fill out the registration form that can also be downloaded below and make the payment using wire transfer or check until April-27-2007.

We would be happy to support you, if you have any questions.
Just call or send an email to

We are happy to see you at the workshop

your IS-Test Team


Download papers and registration form
Registration form in PDF format or as zipped PDF (English)
Invitation in PDF format or as zipped PDF (English)
Invitation in PDF format or as zipped PDF (Deutsch)
Agenda in PDF format or as zipped PDF (English)
Direction to the hotel in PDF format or as zipped PDF (EN and DE)




E-Mail: Please use our [contact form] for further information