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ITWS 2009
3 rd IS-Test Workshop - Call for Papers
"Think In 3-D" and "@ The Limits"
Oct 19 - 20, 2009 --> shifted
As we did in our 1st and 2nd IS-Test Workshop in the past 2 years,
we want to prepare this likewise up to 7 sessions. We would be very
pleased to encourage you to contribute an active part to our 3rd IS-Test
Workshop "Think in 3-D" and "@ The Limits" in this year.
You find a guideline about the conditions your paper should fulfil as follows;
General:
 | your paper may should correspond with one or some of the items as listed in "Table of contents |
| it shall not contain any sales aspects |
| please show solutions, if possible, and/or encourage the auditors to discuss an subject you want to initiate |
| please note: your material will get public at least to all participants of this Workshop |
Time line:
| your presentation should take about 20 ~ 30 minutes |
| it is planned another 15 minutes right after for questions coming from the auditors related to your speech |
Format of papers:
| it is preferred to provide the material in MS- PowerPoint ("ppt") format |
| when you use other peripheral software tools (like Flash Player etc.), please provide them as well |
| all formats & programs should be compatible to MS- Windows 2000 / XP / Vista |
Table of contents:
These are only some proposals. Please feel free to make your suggestion for more themes or to combine the listed ones in a different way. We are open for your ideas!
"Think In 3-D" and "@ The Limits"
(Preferably the opening session which will be held by IS- Test)
| what is behind the titles |
| difficulties & limits |
| existing solutions |
| new challenges |
| outlook to the future |
"Think In 3-D" - MEMS device testing at wafer level;
| New challenges regarding handling of extreme thick wafers ("sandwiches") |
| How to involve new stimuli while testing (mechanically / air pressure / gas atmosphere / fluids / chemicals etc.) |
| Cavities on wafer surface / diced wafers on a plastic frame / different materials than silicon |
| New ways to get in "contact" |
| Frame Handling prober systems / the do's & don'ts |
"Think In 3-D" - MEMS & cleanliness
| Mini- environment equipped on wafer probers |
| Wafer probing is a "dirty" process - "when a probe tip is touching the pad…" |
| Probe card cleaning - "particles everywhere" |
"Think In 3-D" - MEMS & 300mm (12inch)
| Market study / trends |
| New applications |
| Why MEMS is becoming so strong? |
"@ The Limits" - Low, lower, to get lowest leakage
| How to measure and compare the leakage performance of a wafer test system |
| Influences of components (tester / interface / probe card / wafer prober / chuck incl. connection to surface / motors / ambient conditions |
| Chuck process temp. / lights inside the prober / plastic covers around / magnetism etc. |
| What is the definition for leakage / noise / …what means "below 100fA" (example) |
"@ The Limits" - High, higher, to get highest current & voltage
| Safety comes first! |
| Where to put all this high energy away? |
| What is the capability of wafer probing hardware to run stable and reliable in case of shorts and sparks? |
"@ The Limits" - Where are the limits?
| What "kills" low leakage / noise performances |
| Parametric Test Wafer Prober ' advantages & disadvantages of dedicated equipment |
| What about current of 200A or more? |
| What about high voltage - 10kV or more? |
| Future trends & outlook |
Please let us know your intention as much as possible in advance and send us your complete
paper until 15th of August, 2009 as the latest time.
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